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Model Number: 290601290
Brand Name: DAFENG
Key Specifications/Special Features:
Specializing PCB assemblyAccept ODM, OEM serviceArtificial intelligenceLeakage protectionLead free
CAPABILITYSTANDARD
ADVANCED
MinimumLayer Count
1
1
Maximum Layer Count
12
40
Material
FR-4 (Tg-135C, 145C, 170C),Halogen- free
Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003
Polyimide
Teflon
Black FR-4
Arlon AR-350
CEM-3
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
PTFE
Metal Core Materials
Aluminum Core
Board Thickness
0.020"-0.125"
0.005"-0.250"
Maximum Board Size
16"x 22"
12"x 21"
22"x 28"
10"x 16"
16"x 22"
12"x 21"
22"x 28"
Copper Thickness
0.5 oz–3 oz
0.25 oz–12 oz
Minimum Trace Width / Spacing
0.004"/0.004"
0.003"/0.003"
Solder Mask Color
Green, Blue, Black, Red, Yellow, White, Clear, andcustomized
Silkscreen Color
White, Black, Yellow, Green, Red, Blue andcustomized
Minimum Hole Size
0.008"
0.004"
Finished Hole Size Tolerance
+/-0.003"
+/-0.002"
PCB Surface Finish
HASL (vertical & Horizontal), Lead Free HASL, OSP/Entek, ENIG, ENEPIG,
HASL + GoldFinger,Immersion Tin(ISn), ImmersionSilver(IAg), Carbon
Ink, Hard Gold(Flash Gold),Soft Gold
IPC Class
Class 2
Class 3
Controlled Impedance Tolerance
+/-10 %
+/-5 %
Blind Vias
Yes
Yes
Buried Vias
Yes
Yes
Aspect Ratio
8/1
15/1
Minimum Core Thickness
0.004"
0.002"
Carbon Ink
Yes
Yes
Peelable Mask
Yes
Yes
Solder Sample
Yes
Yes
First Article
Yes
Yes
ISO 9001:2008
Yes
Yes
ISO/TS16949: 2009
Yes
Yes
UL 94v0
Yes
Yes
Rogers Ultralam 2000, Rogers RO4350, Rogers RO4003
Polyimide
Teflon
Black FR-4
Arlon AR-350
CEM-3
Getek Copper Clad Thermal Substrates
Hybrid (Rogers and FR4) BT Epoxy
Nelco 4013
PTFE
Metal Core Materials
Aluminum Core
12"x 21"
22"x 28"
16"x 22"
12"x 21"
22"x 28"
HASL + GoldFinger,Immersion Tin(ISn), ImmersionSilver(IAg), Carbon
Ink, Hard Gold(Flash Gold),Soft Gold
Shipping Information:
- FOB Port: Shanghai
- Lead Time: 10 - 25 days
Main Export Markets:
- Asia
- Eastern Europe
- North America
- Western Europe